12" Precision Automatic Grinding/Polishing Machine with Two 4" Semiconductor Wafers and Ceramic EQ-Unipol-1202 Workstation
- $900.00 /set
- 1 set
- Zhengzhou TCH Instrument Co., Ltd.
- Henan, China
- Ms Dorry Chang
| Weight (kg): | 75 | Showroom location: | not any |
| Packaging Details: | Standard export packaging | Local service location: | not any |
| Power (kW): | 1 | product name: | 12" Precision Automatic Grinding/Polishing Machine |
| Origin: | Henan, China | payment terms: | L/C, T/T, Western Union, MoneyGram |
| Health status: | new | port: | Chinese port |
| Supply capacity: | 300 sets per month | After warranty service: | online support, spare parts |
| brand: | TCH | After-sales service provided: | On-site installation, commissioning and training, on-site maintenance and repair services, online support, free spare parts, video technical support |
| Warranty: | 1 year | Main selling points: | Sustainable |
| Applicable industries: | Precision grinding machine |
12" Precision Automatic Grinding/Polishing Machine with Two 4" Semiconductor Wafers and Ceramic EQ-Unipol-1202 Workstation
UNIPOL-1202The machine is equipped with a 12" ultra-flat grinding disc, which can be used as a high-precision grinding machine for polishing crystal components, semiconductor wafers and ceramic substrates up to4" diameter. It can also be used as a standard grinding and polishing machine for metallographic sample preparation.
Specifications for 12" Precision Automatic Grinding/Polishing Machine with Two 4" Semiconductor Wafers and Ceramic EQ-Unipol-1202 Workstation
| strength |
AC 110V and 208-240V (50/60Hz) switchable worldwide. |
| feature |
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| Extra Flat 12" (300 mm) Diameter Grinding Disc | Flatness < 0.25 µm/in² |
| Precision Rotary Shaft | Bleed < 5 microns |
| Heavy-duty cast aluminum housing with varnish | Color: black or white |
| Two workstations with 8° swing and adjustable speed | 8" swing, 0-9 swings/minute adjustable |
| Two flat sample holders for carrying < 4" diameter wafers | Diameter 105 x 35 mm |
| two condition rings | 120 OD x 110 ID x 32 T mm |
| Digital display main disc speed change | 0 ~ 125 rpm |
| Adjustable timer with automatic stop | 0 - 99 hours |
| engine | 300 W high torque DC motor |
| aspect | 700 L x 475 W x 300 H (mm) |
| weight | 154 lbs |
| Optional automatic slurry feeder | Automatic slurry feeder SKZD-2 is not included. The plastic rolling container holds up to 1.0 gallons (~3.8 L) of slurry for extended polishing. |
| Shipping size | 40"x30"x26" |
| Shipping weight | 245 lbs |
optional parts |
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Reference for 12" Precision Automatic Grinding/Polishing Machine with Two 4" Semiconductor Wafers and Ceramic EQ-Unipol-1202 Workstation
