Multilayer pcb circuit board manufacturer 1~30 layers

PRODUCT DETAIL
payment terms:L/C, Western Union, D/P, D/A, T/T, MoneyGram, Paypalproduct name:ru 94VO printed circuit board
Applications:94VO circuit boardBoard Dimensions:green/regular/red/black/yellow
Impedance Control:50/90/100±10% ohmplace of origin; place of origin:Guangdong, China
product design:Anlida DesignTG value:T150-180
Shenzhen circuit board:One-stop serviceport:Shenzhen, China (Mainland)
Minute line width:0.05mm/2milbrand:Anli Dapu circuit board
Flame retardant:94v0Plate thickness:0.15-10mm
Packaging Details:Blister and carton and email: PCB design file, manufacturing file, DXF file, PAST file, Silk file, XY coordinate file.model:M10-Y
Minute Hole Size:0.1mm/4milstandard:IPC-A-610G CLASS II&III
Surface treatment:ENIG OSP SandblastingSupply capacity:80000 square meters / month thick gold plating
Layers:1-40 floors, 12 floorsMinute line spacing:0.06 mm/2.5 million
Substrate:FR-4/PI/FR-4 High TGPackage preview:
Copper thickness:0.25 oz - 12 ozMain services:design manufacture assembly
type:multilayer board
Product Description

1~30 Layers Multilayer pcb circuit board manufacturer

PCB product display:

 

 

 

 

All services:

- High speed PCB design/PCB layout
- High speed PCB SI/PI/EMC analysis
- PCB reverse engineering design, engineering and early design support
- PCBA reverse engineering design
- Rapid 1-24LPCB prototyping, small to medium batch manufacturing
- Professional HDI PCB production
- Rigid-flex board manufacturing
- SMT assembly/PCBA assembly
- PCB parts procurement

 

 

 

 

 

PCB parameters:

Printed circuit board production:

Do not. thing prototype mass production
1 layers 1-30 floors 1-20 floors
2 Maximum panel size ≤1000X1000mm ≤700X700mm
3 Substrate type FR4, High Tg FR4, Rogers, Halogen Free FR4, High Tg FR4, Rogers, Halogen Free
4 Maximum plate thickness ≤10 mm ≤10mm
5 Minimum plate thickness 2L≥0.2mm, 4L≥0.3mm
6L≥0.4mm, 8L≥0.6mm
10L≥0.65mm, 12L≥0.8mm
2L≥0.2mm, 4L≥0.3mm
6L≥0.4mm, 8L≥0.6mm
10L≥0.65mm, 12L≥0.8mm
6 Minimum Line Width ≥ 0.05mm(2mil) ≥ 0.064mm (2.5 million)
7 Minimum line spacing ≥ 0.064mm (2.5 million) ≥0.075mm (3 million)
8 Minimum via 0.15 mm (6 million) 0.15 mm (6 million)
9 Minimum blind hole 0.1 mm (4 million) 0.1 mm (4 million)
10 Minimum Buried Via 0.2mm (8 million) 0.2mm (8 million)
11 Minimum Plated Hole Thickness 20µm (0.8 million) 20µm (0.8 million)
12 surface coating HASL, ENIG, OSP, ENIG+OSP, electroplating Ni/Au/Ag HASL, ENIG, OSP, ENIG+OSP, electroplating Ni/Au/Ag
13 Solder mask color Green, blue, black, white, yellow, red Green, blue, black, white, yellow, red
14 Screen printing color white, black, yellow, red, white, black, yellow, red,
15 thick copper 6oz/210µm 4oz/140µm
16 Minimum S/M spacing 0.1 mm (4 million) 0.1 mm (4 million)
17 PTH diameter tolerance ±0.076mm(±3mil) ±0.076mm(±3mil)
18 NPTH Diameter Tolerance ±0.05mm(±2mil) ±0.05mm(±2mil)
19 Hole position deviation ±0.05mm(±2mil) ±0.05mm(±2mil)
20 Profile Tolerance ±0.15mm (±6mil) ±0.15mm (±6mil)
twenty one Controllable Impedance +/-5% +/-10%
twenty two twist and twist ≤0.75% ≤0.75%
twenty three Flammability rating 94V-0 94V-0
twenty four Solderability Test 255℃+/-5℃ 255℃+/-5℃
25 Thermal Stress 288+5℃, 10 seconds 288+5℃, 10 seconds
26 Test voltage 50-330V 50-330V
27 Adhesion test no peeling no peeling
28 Other inspection items IPC-6012/A-600H IPC-6012/A-600H
Production lead time:
flow chart:

 

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