Fast delivery low cost pcb manufacturing POE OEM manufacturing pcb board rigid flex high frequency pcb
- $0.20 /piece
- 1 piece
- Topfast(Guangdong)Technology Co.,Ltd.
- Guangdong, China
- Ms Alice Li
PRODUCT DETAIL
| Solder Mask: | Green solder mask/black PI/yellow PI | port: | Shenzhen/Guangzhou |
| Product quotation: | within 2 hours | Supply capacity: | 150,000 square meters per year |
| Origin: | Guangdong, China | Minute line spacing: | 3000000 |
| Copper thickness: | 0.5-2oz | legend: | white, black, red, yellow |
| Minute line width: | 3000000 | Serve: | 24 hours technical service |
| Printed Circuit Board Standards: | IPC-A-600 | Board Dimensions: | Custom PCB Dimensions |
| Substrate: | Shengyi, DuPont, PI | Maximum number of layers: | 8L |
| type: | High frequency circuit board | Plate thickness: | 0.1-0.5mm |
| MOQ: | 1 | Packaging Details: | PCB PCBA Manufacturing,Flexible PCB Electronic Circuit Board PCB Assembly PCB: Vacuum Packing with Carton Box PCBA: ESD Packing with Carton Box |
| Key words: | High frequency circuit board | payment terms: | L/C, Western Union, D/P, D/A, T/T, MoneyGram, Alipay |
| Minute Hole Size: | 0.1-6.5mm | Sample delivery: | within 24 hours |
| model: | High frequency circuit board | Surface treatment: | ENIG,HASL,OSP,ENEPIG,Flash Gold |
| brand: | Summit Electronics Co., Ltd. | Package preview: |
Fast delivery low cost pcb manufacturing POE OEM manufacturing pcb board rigid flex high frequency pcb
product information
| thing | boring | flexible | rigid-flexible |
| Maximum number of layers | 60L | 8L | 36L |
| Inner layer minimum trace/space | 3/3 million | 3/3 million | 3/3 million |
| Minimum trace/space on outer layers | 3/3 million | 3.5/4 million | 3.5/4 million |
| Inner Layer Maximum Copper | 6 oz | 2 oz | 6 oz |
| outer layer copper | 6 oz | 2 oz | 3 oz |
| Minimal Mechanical Drilling | 0.15mm | 0.1 mm | 0.15mm |
| Minimal Laser Drilling | 0.1mm | 0.1mm itemRIGIDFLEXRIGID-FLEX | 0.1mm |
| Aspect Ratio (Mechanical Drilling) | 20:1 | 10:1 | 12:1 |
| Aspect Ratio (Laser Drilled) | 1:1 | / | 1:1 |
| Press hole tolerance | ±0.05mm | ±0.05mm | ±0.05mm |
| PTH tolerance | ±0.075mm | ±0.075mm | ±0.075mm |
| NPTH tolerance | ±0.05mm | ±0.05mm | ±0.05mm |
| countersunk tolerance | ±0.15mm | ±0.15mm | ±0.15mm |
| plate thickness | 0.4-8mm | 0.1-0.5mm | 0.4-3mm |
| Plate thickness tolerance (<1.0mm) | ±0.1mm | ±0.05mm | ±0.1mm |
| Plate thickness tolerance (≥1.0mm) | ±10% | / | ±10% |
| Impedance tolerance | Single-ended: ±5Ω (≤50Ω), ±7% (>50Ω) | Single-ended: ±5Ω (≤50Ω), ±10% (>50Ω) | Single-ended: ±5Ω (≤50Ω), ±10% (>50Ω) |
| Differential: ±5Ω (≤50Ω), ±7% (>50Ω) | Differential: ±5Ω (≤50Ω), ±10% (>50Ω) | Differential: ±5Ω (≤50Ω), ±10% (>50Ω) | |
| Minimum board size | 10*10mm | 5*10mm | 10*10mm |
| board size | 22.5*30 inches | 9*14 inch | 22.5*30 inches |
| Profile Tolerance | ±0.1mm | ±0.05mm | ±0.1mm |
| Minimum BGA | 7 million | 7 million | 7 million |
| Minimum SMT | 7*10 million | 7*10 million | 7*10 million |
| surface treatment | ENIG, Gold Finger, Immersion Silver, Immersion Tin, HASL(LF), OSP, ENEPIG, Flash Gold; Hard Gold Plating | ENIG, Gold Finger, Immersion Silver, Immersion Tin, HASL(LF), OSP, ENEPIG, Flash Gold; Hard Gold Plating | ENIG, Gold Finger, Immersion Silver, Immersion Tin, HASL(LF), OSP, ENEPIG, Flash Gold; Hard Gold Plating |
| Solder mask | Green, black, blue, red, matte green | Green solder mask/black PI/yellow PI | Green, black, blue, red, matte green |
| Minimum Solder Mask Clearance | 1.5 million | 3000000 | 1.5 million |
| Minimum Solder Dam | 3000000 | 800w | 3000000 |
| legend | white, black, red, yellow | white, black, red, yellow | white, black, red, yellow |
| Minimum legend width/height | 4/23 million | 4/23 million | 4/23 million |
| Strain Fillet Width | / | 1.5±0.5mm | 1.5±0.5mm |
| bow and twist | 0.30% | / | 0.05% |
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