High Quality Custom Product Bom Gerber Quote Aluminum Nitride Substrate PCB Supplier Multilayer Ceramic PCB Manufacturer
- $3.50 / 1 - 999 pieces
$1.90 / 1000 - 4999 pieces
$0.90 / 5000 - 9999 pieces
$0.10 / >=10000 pieces - 1 piece
- Jinhua Technology (Shenzhen) Co., Ltd.
- Guangdong, China
- Ms Rosia Cao
PRODUCT DETAIL
| Packaging Details: | Bubble bag, pearl cotton bag, anti-static bag, vacuum bag | Key words: | Aluminum nitride circuit board |
| product name: | Order Ceramic PCB | Board Dimensions: | Custom Ceramic Printed Circuit Boards |
| type: | Ceramic circuit board | Package preview: | |
| Copper thickness: | 1-10oz | usage: | Foundry Electronics |
| MOQ: | 1 | Surface treatment: | Immersion Nickel/Gold/Silver/Palladium, OSP |
| Plate thickness: | 0.2-8mm | layer: | 1-32 floors |
| Product quotation: | within 2 hours | Supply capacity: | 50000 pieces per month |
| Origin: | Guangdong, China | Minute line spacing: | 0.075mm |
| Minute line width: | 0.075mm | Printed Circuit Board Services: | 24 hours technical service |
| Substrate: | aluminum, ceramic | Certificate: | ISO9001/Iso14001/CE/ROHS/IATF16949 |
| model: | JH-PCBA-186 | Test service: | 100% electronically tested |
| Minute Hole Size: | 0.07mm±0.02mm | Solder mask color: | Green. Black. Red. Yellow. White. Blue. Purple. Matte Green. matte black |
| port: | Shenzhen | payment terms: | L/C, Western Union, D/P, D/A, T/T, MoneyGram |
| brand: | JH-PCBA |
Why choose us?
Our company has advanced ceramic circuit board processing equipment. It has the ability to be in line with international standards in laser drilling, cutting, ceramic metallization, ceramic electroplating thickening, through hole electroplating and filling, and microcircuit production.
Our advantage:
1. High thermal conductivity
2. Excellent insulation performance
3. Very low expansion coefficient
4. Reduce dielectric constant and loss
5. Chemical corrosion resistance
Product Description
| JH PCBA production capacity | ||
| 1 | project | Ceramic substrate |
| 2 | matrix | Aluminum Oxide, Aluminum Nitride |
| 3 | Conductor Thickness | 10-210um |
| 4 | Thermal Conductivity | Al203, 20-24W/Mk; ALN, 170-220W/Mk |
| 5 | reflection | Normal: 85-92%, High: ≥93% |
| 6 | surface treatment | Ni/Au, chem.AG, OSP, etc. |
| 7 | panel size |
101.6*101.6mm, 114.3*114.3mm, 120*120mm, 130*140mm, 140*190mm |
| 8 | plate thickness | 0.38 mm min, max. 2.0mm |
| 9 | minimum aperture | 0.08mm |
| 10 | Shape Tolerance | ±0.1mm |
| 11 | Peel strength | E needle without broken wire, gold wire ≥ 7g |
| 12 | Dielectric constant | 9-10@1MHz |
| 13 | Dielectric strength | ≥2KV |
| 14 | delivery time | 3-5 days for prototype, 7-10 days for production |
| 15 | Inspection standards | MIL-SID-105, Class 2, AOL=0.65 |
| layer | Quick turn/Usual time | mass production |
| 2 liters | 24 hours/4-5 days | 8-10 days |
| 4L | 48 hours/6-7 days | 10-12 days |
| 6L | 72 hours/7-8 days | 12-14 days |
| 8L | 72 hours/8-10 days | 16-18 days |
| 10L | 96 hours/12-14 days | 18-20 days |
production process
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