best china kb 3151c fr-1 pcb with rohs long lifespan
- $2.00 / >=5 pieces
- 5 pieces
- Gesp Technology (Dalian) Co., Ltd.
- Liaoning, China
- Ms Miki Liu
| standard: | IPC Class 2, Class 3 | place of origin; place of origin: | Liaoning, China |
| maximum. Panel size: | twenty two | Certificate: | ISO/RoHS/TS16949 |
| Impedance Control: | yes | payment terms: | L/C, Western Union, D/P, D/A, T/T |
| Types of: | double sided printed circuit board | Surface treatment: | HASL/enig/OSP/Immersion Silver/Gold Finger |
| port: | Dalian, Shenzhen, Hong Kong | Supply capacity: | 8000 square meters per month |
| Substrate: | FR-4 | Plate thickness: | 0.005 |
| brand: | GESP | Substrate: | FR-4,CEM-3, Roger, taconic,arlon , metal/ceramic/aluminum base |
| Copper thickness: | 0.25 oz - 12 oz | Minute Hole Size: | 0.15mm |
| Packaging Details: | Inner packing: vacuum bag Outer packing: carton | Minute line width: | 5000000 |
| V-cut rating: | yes | Gold Thickness: | 0.05 micron |
| Copper thickness: | 0.25 oz - 12 oz | Minute line spacing: | 4000000 |
| Plate thickness: | 1.6mm-3.2mm 0.2mm-4.5mm | model: | 2-layer printed circuit board |
| Surface treatment: | HASL lead-free/OSP/soft gold/hard gold |
|
ability |
standard |
advanced |
|
Minimum number of layers |
1 |
1 |
|
Maximum number of layers |
12 |
40 |
|
Material |
FR-4 (Tg-135C, 145C, 170C), Halogen Free Rogers Ultralam 2000, Rogers RO4350, Rogers RO4003 Polyimide Black FR-4 Aron AR-350 CEM-3 Getek Copper Clad Thermal Substrates Hybrid (Rogers and FR4) BT epoxy Nelco 4013 PTFE metal core material aluminum core |
|
|
plate thickness |
0.020"-0.125" |
0.005"-0.250" |
|
Maximum Board Size |
16" x 22" 12" x 21" 22" x 28" |
10" x 16" 16" x 22" 12" x 21" 22" x 28" |
|
copper thickness |
0.5 oz – 3 oz |
0.25 oz – 12 oz |
|
Minimum trace width/spacing |
0.004"/0.004" |
0.003"/0.003" |
|
Solder mask color |
Green, blue, black, red, yellow, white, transparent and customized |
|
|
silk screen color |
white, black, yellow, green, red, blue and customized |
|
|
minimum aperture |
0.008" |
0.004" |
|
Finished Hole Size Tolerance |
+/-0.003" |
+/-0.002" |
|
Printed Circuit Board Surface Treatment |
HASL (vertical and horizontal), lead-free HASL, OSP/Entek, ENIG, ENEPIG, HASL + gold finger, immersion tin (ISn), immersion silver (IAg), carbon Ink, hard gold (flash gold), soft gold |
|
|
IPC level |
level 2 |
Level 3 |
|
Controlled Impedance Tolerance |
+/-10% |
+/-5% |
|
Blind hole |
yes |
yes |
|
buried hole |
yes |
yes |
|
aspect ratio |
8/1 |
15/1 |
|
Minimum core thickness |
0.004" |
0.002" |
|
carbon ink |
yes |
yes |
|
tear off mask |
yes |
yes |
|
Solder sample |
yes |
yes |
|
first time |
yes |
yes |
|
ISO 9001: 2008 |
yes |
yes |
|
ISO/TS16949:2009 |
yes |
yes |
|
UL 94v0 |
yes |
yes |
