Qualcomm QCC5125 MIC Bluetooth 5.0 Analog Digital Audio Module Support APTX-HD APTX-LL APTX LDAC Codec DSP I2S SPDIF
- $9.00 / 2 - 19 pieces
$8.78 / 20 - 999 pieces
$8.58 / 1000 - 9999 pieces
$7.88 / >=10000 pieces - 2 pieces
- HoneyComm IoT Technology (Shenzhen) Co., Ltd.
- Guangdong, China
- Ms Gigi Sue
PRODUCT DETAIL
| port: | Shenzhen or Hong Kong | frequency band: | 2.402-2.480 GHz |
| Supply capacity: | 100,000 Bluetooth audio modules per month | Transmitting power: | +9dBm |
| Module size: | 13mm×18mm×2.8mm | application: | Car audio applications |
| Packaging details: | Bluetooth audio module electrostatic bag, pearl wood, carton | country of origin: | China |
| chipset: | QCC3008 | protocol: | A2DP, AVRCP, HFP, HSP, PBAP, SPP, GATT |
| voltage: | 2.8~4.3V | payment terms: | Wire transfer, PayPal |
| Bluetooth version: | 5.1 | chip: | QCC5125 ball grid array |
| type: | Bluetooth audio module | feature: | Digital and analog microphone interfaces |
| model: | HCBTM525 | Serial interface: | UART, Bit Serializer (I²C/SPI), USB 2.0 |
| Audio decoding: | apt-X, apt-X low latency, AAC, SBC | brand: | HoneyComm/ByteRFly |
Specification
Product Description | Bluetooth 5.1 Class1.5 module |
bluetooth standard | Bluetooth 5.1 |
chipset | QCC5125 ball grid array |
aspect | 13mm×18mm×2.8mm |
Operating conditions | |
Voltage | 2.8~4.3V |
temperature | -40～+85℃ |
Storage temperature | -40～+85℃ |
Electrical Specifications | |
Frequency Range | 2402～2480MHz |
Maximum RF transmit power | 9 decibels |
π/4 DQPSK receiving sensitivity | -92dBm |
8DPSK receiving sensitivity | -85dBm |
Overview
Bluetooth 5.1 module HCBTM525 is a high-performance, cost-effective, low-power and compact solution. This Bluetooth module provides a complete 2.4GHz Bluetooth system based on the QCC5125 BGA chipset, which is a single-chip radio and baseband IC for Bluetooth 2.4GHz systems. This module is a fully qualified single-chip dual-mode [email protected] system.
emphasize
- Bluetooth® v5.1 specification compliant - 120 MHz Qualcomm® Kalimba™ audio DSP - 32 MHz development processor for applications - Firmware processor for systems - Flexible QSPI flash programmable platform - Advanced audio algorithms - High Performance 24-bit stereo audio interface - Digital and analog microphone interface - Active noise cancellation: feedforward, feedback, hybrid - Serial interfaces: UART, bit serializer (I²C/SPI), USB 2.0 - Integrated PMU: for system /Dual SMPS for digital circuits, integrated Li-ion battery charger - 20 PIOs, 5 LED pads with PWMapplication subsystem
1. Dual-core application subsystem running at 32 MHz 2. 32-bit firmware processor: reserved for system use to run Bluetooth upper stack, configuration files, housekeeping code 3. 32-bit developer processor: running developer applications 4. Two Cores are executed from external flash memory using QSPI clocked at 32MHz5. On-chip cache per core enables optimized performance and power consumption
Bluetooth subsystem
1. Complies with Bluetooth v5.1 specification, including 2 Mbps Bluetooth Low Energy (production part) 2. Single-ended antenna connected with on-chip balun and Tx/Rx switch 3. Supports Bluetooth, Bluetooth Low Energy and hybrid topologies 4. Category 1 support
Application areas
1. Wired/wireless stereo headset/headphones 2. Qualcomm TrueWireless™ stereo earbuds 3. USB to Bluetooth adapter
Default firmware description
1. Support SBC, AAC, aptx, aptx ll, aptx HD, aptx adaptive decoding, no call function, optional I2S, SPDIF, analog output2. Button description:SYS_CTRL: High level to power on, low level to power off, automatically enter pairing mode when powering on. PIO2: Short press to pause playback, long press for 3 seconds to enter pairing, long press for 5 seconds to clear pairing record. Press pio3 to reduce volume. PIO4: Short press a song. , long press to increase the volume PIO5: connected to high level, not connected to low level PIO19: audio output high level, no audio low level PIO20: SPDIF output portIndicator light description:Bluetooth is not connected: LED0 LED1 flashes alternately Bluetooth is connected: LED1 is always on Bluetooth audio playback: LED1 is always on
>> How to get samples?
1. You can find the product you want and place an order, ready for shipment. 2. Contact us for quantity, model and shipping method 3. We can receive sample payment via PayPal or Alibaba platform. 4. Sample orders usually take 1-2 working days to ship because the firmware is flashed and 100% inspected before shipping. 5. Samples are packaged in ultra-small bags with electrostatic protection and small paper hard boxes. 6. Generally, use DHL.FEDX, UPS, TNT/EMS or Postal Air Mail for international express delivery.
>> How to get technical support?
1. Contact us via email, Skype, Whatsapp and AlibabaTM, or even WeChat for help. 2. Once customers purchase samples from us, we will continue to support them until the project is completed. 3. We have good resources and technical support from the original chip factory.
>> Can the hardware, firmware and OEM boards be customized?
1. If our standard modules cannot meet your needs, we will evaluate and help customize. MOQ 1Kpcs and 5pcs free sample. 2. If you do not have a power engineering team, we will be your partner and charge a certain fee. 3. If your motherboard uses our modules, we can also help you manufacture your motherboard and our modules together.
>> Why choose MiKang?
1. 7*24 hours quick response 2. Professional, continuous and patient technical support 3. Provide drivers, SDK and development kits 4. More than 20 years of hardware and firmware RF design experience 5. 6 SMT/EMS production lines 6. Thousand Three-thirds of the defective rate helps customers save costs 7. Efficient production capacity helps customers seize market opportunities in a timely manner 8. Second-source supply chain to avoid delivery delays 9. 100% inspection before delivery 10. No need to flash additional firmware 11. Rich OEM/ODM experience, strong engineering team 12. Low minimum order quantity and samples 13. Digital enterprise management of customer projects and orders 14. Incoming materials must be sampled 15. Fixed assets are regularly maintained and updated 16. Strict static electricity Protection requirements for dust-free warehouses and production lines
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